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Tecbond 114

Economical & Fast Setting Packaging Adhesive

Tecbond 114 is an economical, off-white coloured hot melt adhesive designed for most packaging applications involving uncoated cardboard. It’s short open time of around 10 seconds speeds up production processes by allowing substrates to be bonded and moved without the need for extended compression periods.

Primarily designed for the manual carton closing industry, Tecbond 114 is a more cost-effective and reliable solution when compared to tapes and staples.

Dimensions (mm) :
12, 15, 43
Catégories :
Chimie :
EVA
Offene zeit:
10 secondes
Auftragstemperatur:
195°C
Viskosität / cPs - Adhésif :
3000
Point de ramollissement :
110°C
Résistance à la chaleur :
80°C
Basse température
-10°C
Couleur :
Blanc cassé
Tecbond 114
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