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Tecbond 901-PL

Clear Pressure Sensitive Adhesive

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Tecbond 901-PL is a low viscosity pressure sensitive hot melt adhesive designed for applications that require good heat resistance and high sheer strength.

Although most effective around 195°C, Tecbond 901-PL can be applied at lower temperatures to avoid damaging heat sensitive materials such as foam, Styrofoam and other forms of expanded polystyrene.

Predominantly used in the packaging industry, the adhesive is clear in colour, making it near invisible after application as to not disrupt the visual appeal of the product.

Sizes (mm):

Bulk

Categories :

Packaging & Print

Chemistry:

Rubber

Open time:

Pressure Sensitive

Application temp:

140-180°C

Viscosity / cPs – Adhesive:

2800

Softening point:

96°C

Heat resistance:

65°C

Low temp:

-20°C

Colour:

Clear

Tecbond 901-PL

Related applications

Packaging Inserts

Product security is crucial for delivering a high-quality service and ensuring brand reputation. Commonly used packaging inserts often detach, risking damage and cost. Tecbond adhesive solutions ensure inserts remain secure, protecting your products and brand image.

Point of sale

Our hot melt solutions offer the perfect mix of tough, reliable bonds on a variety of materials, without being obtrusive and impacting overall operational costs

XY Plotter

XY plotters for print and graphics need adhesives compatible with fine-line applications. Tecbond adhesives offer extended open times, temperature versatility, and cost efficiency for bonding various substrates.

Furniture & Upholstery

Tailored to meet the stringent requirements of fast-paced manufacturing facilities, our sprayable hot melt solutions are redefining the production of furniture and upholstery.

Mattress Assembly

Eliminating the challenges faced by using water and solvent-based adhesives when assembling mattresses, hot melt adhesives provide exceptional bond strength combined with flexibility.

Carton Closing

Guaranteeing efficient, reliable packaging solutions. Versatile across various packaging substrates, our packaging adhesives improve bond strength and integrity over staples and tapes, offering a clean, cost-effective sealing solution.

Tray Assembly

Packaging trays often use complex folds that fail with wear or weak materials. Tecbond hot melt adhesives provide durable, flexible bonds, ideal for commonly used packaging substrates.

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