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Tecbond 351B-PR

Low Viscosity Biodegradable Bulk Packaging Adhesive

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Tecbond 351B-PR is a biodegradable, bulk format packaging adhesive with an extremely fast-setting speed and low viscosity, developed for high volume applications.

Compatible with all forms of bulk machinery, Tecbond 351B-PR’s lower viscosity both reduces nozzle clogging during long production runs, but also enables tighter joins between the bonded materials.

Along with being very versatile, the adhesives low odour and exceptional heat stability allow it to sit in a molten state for extended periods without charring.

The degradation process will occur in the presence of oxygen. When the adhesive is exposed to ultraviolet light, the speed of the degradation process is greatly increased. The adhesive should be kept away from direct sunlight when not in use.

Sizes (mm):

Bulk

Categories :

Packaging & Print

Chemistry:

EVA

Open time:

10 seconds

Application temp:

140-180°C

Viscosity / cPs – Adhesive:

500 @ 180°C

Softening point:

106°C

Heat resistance:

80°C

Low temp:

0°C

Colour:

Off-White

Tecbond 351B-PR

Related applications

Carton Closing

Guaranteeing efficient, reliable packaging solutions. Versatile across various packaging substrates, our packaging adhesives improve bond strength and integrity over staples and tapes, offering a clean, cost-effective sealing solution.

Packaging Inserts

Product security is crucial for delivering a high-quality service and ensuring brand reputation. Commonly used packaging inserts often detach, risking damage and cost. Tecbond adhesive solutions ensure inserts remain secure, protecting your products and brand image.

Tray Assembly

Packaging trays often use complex folds that fail with wear or weak materials. Tecbond hot melt adhesives provide durable, flexible bonds, ideal for commonly used packaging substrates.

XY Plotter

XY plotters for print and graphics need adhesives compatible with fine-line applications. Tecbond adhesives offer extended open times, temperature versatility, and cost efficiency for bonding various substrates.

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