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Tecbond 550

Low Viscosity Plasterboard Adhesive

Tecbond 550 is an amber v-groove adhesive for large-scale plasterboard and drywall fabrication. The adhesive is formulated with a higher output and lower viscosity than Tecbond 523, ideal for scenarios where tighter joins are required.

The adhesives low viscosity also allows it to effectively flow in the porous surface of the plasterboard, increasing physical bond strength, while its very high molten tack ensures an almost instant hold without the need for extended holding or clamping periods. The finished bond is so strong, the plasterboard will break before the bond does.

Größen (mm):
43
Kategorien:
Chemie:
EVA
Offene zeit:
10 Sekunden
Auftragstemperatur:
180-195°C
Viskosität / cPs - Klebstoff:
1500
Erweichungspunkt:
105°C
Hitzebeständigkeit:
70°C
Niedrige Temperatur:
0°C
Farbe:
Blasser Bernstein
Tecbond 550
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