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Märkte und Anwendungen

Tecbond 802-PL

High-Performance Peelable Adhesive

Tecbond 802-PL is a bulk hot melt adhesive designed to provide a light, peelable bond to many plastics.

Similarly to Tecbond 210, Tecbond 802-PL is primarily used to bond credit cards, labels and promotional items to printed material. The adhesive is designed to be very clean running with low char and stringing characteristics.

Although the bond is strong enough to hold the required materials, it will easily peel away with enough force, without damaging the substrates.

Größen (mm):
Bulk
Kategorien:
Chemie:
Gummi
Offene zeit:
Druckempfindlich
Auftragstemperatur:
140-180°C
Viskosität / cPs - Klebstoff:
4000 @ 180°C
Erweichungspunkt:
104°C
Hitzebeständigkeit:
75°C
Niedrige Temperatur:
-30°C
Farbe:
Klar
Tecbond 802-PL
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