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Tecbond 7786-FR

Adhésif résistant aux hautes températures
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Tecbond 7786-FR is a polyamide hot melt adhesive specifically designed with class-leading high and low-temperature resistance. Predominantly used for low-volume overmoulding and product assembly applications in the electronics industry, Tecbond 7786-FR provides excellent bonds on light gauge metals, PCBs, and many plastics such as PVC and ABS.

Coupled with its high and low-temperature resistance, Tecbond 7786-FR has a very high molten tack that provides an almost instant grab upon substrate compression.

We recommend that Tecbond 7786-FR be kept in its original packaging out of direct sunlight to ensure maximum shelf life.

Dimensions (mm) :
Bulk
Chimie :
Polyamide
Offene zeit:
<10 seconds
Auftragstemperatur:
180-215°C
Viskosität / cPs - Adhésif :
4800 @ 190 °C
Point de ramollissement :
155°C
Résistance à la chaleur :
145°C
Basse température
-40°C
Couleur :
Noir
Tecbond 7786-FR

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