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Mercati e applicazioni

Tecbond 7786-FR

Adesivo resistente alle alte temperature

Tecbond 7786-FR is a polyamide hot melt adhesive specifically designed with class-leading high and low-temperature resistance. Predominantly used for low-volume overmoulding and product assembly applications in the electronics industry, Tecbond 7786-FR provides excellent bonds on light gauge metals, PCBs, and many plastics such as PVC and ABS.

Coupled with its high and low-temperature resistance, Tecbond 7786-FR has a very high molten tack that provides an almost instant grab upon substrate compression.

We recommend that Tecbond 7786-FR be kept in its original packaging out of direct sunlight to ensure maximum shelf life.

Dimensioni (mm):
Bulk
Chimica:
Poliammide
Offene zeit:
<10 seconds
Auftragstemperatur:
180-215°C
Viskosität / cPs - Adesivo:
4800 @ 190 °C
Punto di rammollimento:
155°C
Resistenza al calore:
145°C
Bassa temperatura:
-40°C
Colore:
Nero
Tecbond 7786-FR
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