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Mercati e applicazioni

Tecbond 5-PR

Fast Setting Packaging Adhesive

Tecbond 5-PR is a 45% bio-based, bulk hot melt adhesive designed to provide versatile bonds across various packaging applications.

Predominantly used on paper, board and wood surfaces, Tecbond 5-PR is fast setting with a short open time for quicker production runs. Its low viscosity promotes clean running and minimizes the gap between compressed surfaces for tighter joints.

Dimensioni (mm):
Bulk
Chimica:
EVA
Offene zeit:
10 secondi
Auftragstemperatur:
180-195°C
Viskosität / cPs - Adesivo:
1400 @ 180 °C
Punto di rammollimento:
105°C
Resistenza al calore:
70°C
Bassa temperatura:
0°C
Colore:
Ambra pallida
Tecbond 5-PR
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