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Tecbond 261

High Strength Assembly Adhesive

Tecbond 261 is a versatile and strong product assembly adhesive with the ability to bond a variety of substrates, including wood, metal, glass, ceramics, and many plastics, including polypropylene. The adhesive’s high bond strength and flexibility also make it ideal for many general-purpose applications.

Along with its high bond strength, Tecbond 261 features a long open time, allowing for the accurate positioning of substrates before compression, at which point the adhesive sets quickly with enough bond flexibility to withstand small substrate movements.

Sizes (mm):
12, 15, 43
Chemistry:
EVA
Open time:
30 seconds
Application temp:
130-195
Viscosity / cPs – Adhesive:
Softening point:
Heat resistance:
Low temp:
Colour:
Pale Amber
Tecbond 261

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