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Glue Size: 15mm

Casttec 39

Casttec 39 is a clear precast adhesive designed to applied at lower temperatures, making it the ideal adhesive for heat-sensitive substrates. It can be applied over a light oil, removing the need to clean surfaces before application.

Casttec 39 replaces the need for welding or bolting inserts to precast forms, providing a less destructive, cost-saving alternative for precast concrete manufacturers.

The adhesive will begin to crystalise after around 8–10 hours and after 24 hours, the adhesive is brittle enough to allow the easy removal of the bonded inserts. The remaining glue can then be scraped off and disposed of.

Foundrytec 708

Foundrytec 708 is an amber coloured, polyamide-based hot melt adhesive designed for bonding sand cores in the foundry industry. Foundrytec 708 has class-leading heat-resistance and allows finished cores to be oven dried at much higher temperatures.

When compared to Foundrytec 705, Foundrytec 708 has a lower viscosity for tighter joins between core pieces and a shorter open time leading to faster formation of the overall bond.

Foundrytec 701

Foundrytec 701 is a white, hot melt adhesive designed for bonding sand cores in the foundry industry. Foundrytec 701 has excellent heat-resistance, ideal for foundries that oven dry finished cores at temperatures of around 90°C to 100°C.

The adhesives long open time facilitates use with larger core sections that may not be brought together immediately after adhesive application. In some instances, bonds may take up to 24 hours to develop maximum heat resistance and bond strength.

Tecbond LM41

Tecbond LM41 is a clear, all-purpose adhesive formulated for use in low melt glue guns. Featuring impressive output with minimal stringing, its class-leading bond strength provides excellent adhesion to a range of substrates, including paper, card, wood, ceramic, fabric, foam, and some plastics including coated boards.

Used across a number of industries including packaging, product assembly, construction and DIY, the adhesive can be easily pigmented, making it one of the very few low melt adhesives on the market that can be made into almost any colour.

Tecbond LM46

Tecbond LM46 is an economical packaging adhesive, formulated to run at temperatures as low as 130°C. Featuring a faster setting speed than other Tecbond low melt adhesives, Tecbond LM46 provides good adhesion to many of the most common packaging substrates, including paper, card, foam, and some plastics.

Tecbond LM46s properties can be adjusted by varying the application temperature. When applied at 160°C, the adhesive has a lower viscosity and longer open time. When applied closer to 130°C, the viscosity increases to provide better gap filling with a reduced open time.

Tecbond 7784

Tecbond 7784 is an amber product assembly adhesive designed for use on metal, wood, glass, ceramics, and many plastics. Tecbond 7784 has been specially formulated to provide both high and low-temperature resistance, with strong and flexible bonds at temperatures as high as 120°C and as low as -60°C. This makes it especially useful for many product-assembly and electrical applications involving working machinery.

As with many other polyamide adhesives, Tecbond 7784 is resistant to most oils, fuels, and grease as well as mild chemicals. It is commonly used in car engines and oil filters to not only hold components in place but also prevent some components from coming into contact with each other (such as oil filter fins).

Tecbond 7718

Tecbond 7718 is a polyamide hot melt adhesive designed for potting and encapsulation applications. Available in amber and black, Tecbond 7718 has very low viscosity to improve flow rate with a setting time of around two minutes to speed up production processes.

Tecbond 7718 has been used for many years in the consumer electronics industry to protect electronic components and ensure there is no movement which could cause lasting damage.

Tecbond 7786

Tecbond 7786 is a polyamide hot melt adhesive specifically designed with class-leading high and low-temperature resistance. Predominantly used for low-volume overmoulding and product assembly applications in the electronics industry, Tecbond 7786 provides excellent bonds on light gauge metals, PCBs, and many plastics such as PVC and ABS.

Coupled with its high and low-temperature resistance, Tecbond 7786 has a very high molten tack that provides an almost instant grab upon substrate compression.

We recommend that Tecbond 7786 be kept in its original packaging out of direct sunlight to ensure maximum shelf life.

Tecbond 5

Tecbond 5 is a specialist woodworking and carpentry adhesive developed for use on both soft and hardwoods. As well as replacing the need for tacks and screws in many circumstances, Tecbond 5’s properties make it the ideal holding adhesive for temporary bonding applications.

A polymer-based hot melt adhesive, Tecbond 5 is designed for bonding interior trim, drawer bottoms, templates, cabinet backs, and glue blocks. Although designed to be used predominantly on wood, its high tack and excellent adhesion mean Tecbond 5 can also bond many plastics, ceramics, and light gauge metals.

Tecbond 14

Tecbond 14 is a very fast-setting packaging adhesive designed for use on most paper and board substrates. It is ideal for carton closing and tray forming, and suitable for specialty packaging, point of sale, and wrap-around cartons.

The adhesive is formulated to maximise delivery rate, and sets very fast when compressed. These two features mean packages can be secured in a fraction of the time when compared to taping or stapling. There’s also no need to hold the materials in place as the bond is almost instantaneous.

Tecbond 23

Tecbond 23 is an EVA-based multi-purpose product assembly adhesive designed for use on fabrics, ceramics, wood, and many plastics such as PVC, polycarbonate, and acrylics (not PP or PE). This makes it a good all-around adhesive for product assembly and construction applications.

The adhesives extended open and working time provide security in the production process, allowing adjustments to be made shortly after initial compression before the final bond is made.