Skip to main content

Market or Application: Home improvement

Tecbond 23-PR

Tecbond 23 is a multi-purpose product assembly adhesive in a prill format. The adhesive will provide strong and reliable bonds on a number of common construction materials such as ceramics, wood, fabrics, and many plastics such as PVC, polycarbonate, and acrylics (not PP or PE).

The adhesives extended open and working time provide security in the production process, allowing adjustments to be made shortly after initial compression before the final bond is made.

Tecbond 1X

Tecbond 1X is a woodworking and packaging adhesive designed to bond cardboard, paper, and wood substrates. Tecbond 1X has been specifically formulated to have a lower viscosity than many other market comparable adhesives, resulting in better surface penetration and tighter final joints.

Alongside tighter joints, Tecbond 1X’s low viscosity provides excellent output when used in conjunction with Tec applicators.

Tecbond 5

Tecbond 5 is a specialist woodworking and carpentry adhesive developed for use on both soft and hardwoods. As well as replacing the need for tacks and screws in many circumstances, Tecbond 5’s properties make it the ideal holding adhesive for temporary bonding applications.

A polymer-based hot melt adhesive, Tecbond 5 is designed for bonding interior trim, drawer bottoms, templates, cabinet backs, and glue blocks. Although designed to be used predominantly on wood, its high tack and excellent adhesion mean Tecbond 5 can also bond many plastics, ceramics, and light gauge metals.

Tecbond 23

Tecbond 23 is an EVA-based multi-purpose product assembly adhesive designed for use on fabrics, ceramics, wood, and many plastics such as PVC, polycarbonate, and acrylics (not PP or PE). This makes it a good all-around adhesive for product assembly and construction applications.

The adhesives extended open and working time provide security in the production process, allowing adjustments to be made shortly after initial compression before the final bond is made.