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Tecbond 7786-PR

Written by Ellis Fowler on .

Tecbond 7786-PR is a polyamide hot melt adhesive specifically designed with class-leading high and low-temperature resistance. Predominantly used for low-volume overmoulding and product assembly applications in the electronics industry, Tecbond 7786-PR provides excellent bonds on light gauge metals, PCBs, and many plastics such as PVC and ABS.

Coupled with its high and low-temperature resistance, Tecbond 7786-PR has a very high molten tack that provides an almost instant grab upon substrate compression.

We recommend that Tecbond 7786-PR be kept in its original packaging out of direct sunlight to ensure maximum shelf life.

Tecbond 14-PR

Written by Ellis Fowler on .

Tecbond 14-PR is a fast-setting bulk adhesive designed for packaging applications predominately those involving paper and board substrates. It is ideal for carton closing and tray forming, and suitable for specialty packaging, point of sale, and wrap-around cartons.

The adhesive is formulated to maximise delivery rate, and sets very fast when compressed. These two features mean packages can be secured in a fraction of the time when compared to taping or stapling. There’s also no need to hold the materials in place as the bond is almost instantaneous.

Tecbond 6002

Written by Ellis Fowler on .

Tecbond 6002 is a pale amber, low-odour packaging adhesive designed for high-speed packaging runs where fast setting speeds are required. Predominantly used for carton closing and wrap around packaging, Tecbond 6002 will bond most paper and cardboard substrates.

Its very high molten tack, along with its short open time means bonds are near instantaneous upon compression, within little-to-no holding time required.

Foundrytec 601

Written by Ellis Fowler on .

Foundrytec 601 is a pale-amber hot melt adhesive designed for bonding sand cores in the foundry industry. Foundrytec 601 is designed to have a very fast setting speed, removing the need for storage spaces dedicated to core drying.

Alongside its rapid setting speeds, Foundrytec 601 has good heat resistance, ideal for cores that require oven drying after completion.

Tecbond 7786

Written by Power Adhesives on .

Tecbond 7786 is a polyamide hot melt adhesive specifically designed with class-leading high and low-temperature resistance. Predominantly used for low-volume overmoulding and product assembly applications in the electronics industry, Tecbond 7786 provides excellent bonds on light gauge metals, PCBs, and many plastics such as PVC and ABS.

Coupled with its high and low-temperature resistance, Tecbond 7786 has a very high molten tack that provides an almost instant grab upon substrate compression.

We recommend that Tecbond 7786 be kept in its original packaging out of direct sunlight to ensure maximum shelf life.

Tecbond 210

Written by Power Adhesives on .

Tecbond 210 is a clear, fast setting hot melt adhesive designed to create temporary bonds that are easily removable. Formulated for use on paper, card, and coated surfaces, Tecbond 210 is predominantly used for attaching credit cards, labels, and promotional material to mailing letters, magazine pages or backing cards.

Tecbond 210 has excellent high and low temperature resistance, with bonds being able to withstand temperatures as high as 120°C and as low as -70°C without creeping.

Tecbond 14

Written by Power Adhesives on .

Tecbond 14 is a very fast-setting packaging adhesive designed for use on most paper and board substrates. It is ideal for carton closing and tray forming, and suitable for specialty packaging, point of sale, and wrap-around cartons.

The adhesive is formulated to maximise delivery rate, and sets very fast when compressed. These two features mean packages can be secured in a fraction of the time when compared to taping or stapling. There’s also no need to hold the materials in place as the bond is almost instantaneous.