Tecbond 268-PL

Tecbond 268-PL is a bulk format, product assembly adhesive, designed to bond difficult plastics including polypropylene and polyethylene.

Tecbond 268-PL has been formulated to have class-leading high temperature resistance, allowing it to both be applied at warmer temperatures without affecting setting speeds, and have the final bond be exposed to temperatures exceeding 90°C without failing.

Alongside its high-temperature resistance, Tecbond 268-PL has a shorter open time for fast-paced manufacturing facilities.

Due to the difficulties involved in bonding PP and PE, it’s recommended that the adhesive is applied at 195°C (383°F) or higher.