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Open time: 10-20s

Tecbond 114

Tecbond 114 is an economical, off-white coloured hot melt adhesive designed for most packaging applications involving uncoated cardboard. It’s short open time of around 10 seconds speeds up production processes by allowing substrates to be bonded and moved without the need for extended compression periods.

Primarily designed for the manual carton closing industry, Tecbond 114 is a more cost-effective and reliable solution when compared to tapes and staples.

Tecbond 355B-PR

Tecbond 355B-PR is a biodegradable, bulk format, metallocene-based packaging adhesive formulated to bond difficult substrates, especially those which have a lacquered or varnished finish. It is one of the most high-performance adhesives in the Tecbond bulk range.

Its fast-setting speed, coupled with low temperature resistance makes it the ideal adhesive for manufacturers of packaging that may experience storage temperatures as low as -30°C. The adhesive has very low thermal degradation/charring, which contributes to its clean running capabilities.

The degradation process will occur in the presence of oxygen. When the adhesive is exposed to ultraviolet light, the speed of the degradation process is greatly increased. The adhesive should be kept away from direct sunlight when not in use.

Tecbond 351B-PR

Tecbond 351B-PR is a biodegradable, bulk format packaging adhesive with an extremely fast-setting speed and low viscosity, developed for high volume applications.

Compatible with all forms of bulk machinery, Tecbond 351B-PR’s lower viscosity both reduces nozzle clogging during long production runs, but also enables tighter joins between the bonded materials.

Along with being very versatile, the adhesives low odour and exceptional heat stability allow it to sit in a molten state for extended periods without charring.

The degradation process will occur in the presence of oxygen. When the adhesive is exposed to ultraviolet light, the speed of the degradation process is greatly increased. The adhesive should be kept away from direct sunlight when not in use.

Tecbond 7718-PR

Tecbond 7718-PR is a bulk format, polyamide hot melt adhesive designed for potting and encapsulation applications. Available in amber and black, Tecbond 7718-PR has very low viscosity to improve flow rate and ensure clean running during extended production runs. Coupled with it’s fast setting time of around two minutes, Tecbond 7718-PR is ideal for speeding up production processes.

Tecbond 7718 has been used for many years in the consumer electronics industry to protect electronic components and ensure there is no movement which could cause lasting damage.

Tecbond 355-PR

Tecbond 355-PR is a bulk format, metallocene-based packaging adhesive formulated to bond difficult substrates, especially those which have a lacquered or varnished finish. It is one of the most high-performance adhesives in the Tecbond bulk range.

Its fast-setting speed, coupled with low temperature resistance makes it the ideal adhesive for manufacturers of packaging that may experience storage temperatures as low as -30°C. The adhesive has very low thermal degradation/charring, which contributes to its clean running capabilities.

Tecbond 351-PR

Tecbond 351-PR is a bulk format packaging adhesive with an extremely fast-setting speed and low viscosity, developed for high volume applications.

Compatible with all forms of bulk machinery, Tecbond 351-PR’s lower viscosity both reduces nozzle clogging during long production runs, but also enables tighter joins between the bonded materials.

Along with being very versatile, the adhesives low odour and exceptional heat stability allow it to sit in a molten state for extended periods without charring.

Tecbond 214-PR

Tecbond 214-PR is an economical packaging adhesive designed for use on most paper and board substrates. Tecbond 214-PR is the bulk version of Tecbond 214 and as such, is one of the best-selling bulk adhesives in the Tecbond bulk range.

Formulated using 40% bio-based materials, Tecbond 214-PR’s short open time speeds up carton closing procedures, with no need for extended holding or clamping periods after compression. Coupled with the adhesives cost per closure, Tecbond 214-PR is the ideal replacement for staples or tape for cardboard bonding applications.

Tecbond 214B-PR

Tecbond 214B-PR is a biodegradable packaging adhesive, formulated with 45% bio-based, sustainably sourced raw materials. Tecbond 214B-PR is one of the best-selling packaging adhesives due to its strong bonding capabilities, high molten tack, and fast setting speeds.

The degradation process will occur in the presence of oxygen. When the adhesive is exposed to Ultraviolet light the speed of the degradation process is greatly increased. The adhesive should be kept away from direct sunlight when not in use.

Tecbond 214B-PR’s short open time speeds up carton closing procedures, with no need for extended holding or clamping periods after compression. Coupled with the adhesives cost per closure, Tecbond 214B-PR is the ideal replacement for staples or tape for cardboard bonding applications.

Tecbond 5-PR

Tecbond 5-PR is a 45% bio-based, bulk hot melt adhesive designed to provide versatile bonds across various packaging applications.

Predominantly used on paper, board and wood surfaces, Tecbond 5-PR is fast setting with a short open time for quicker production runs. Its low viscosity promotes clean running and minimizes the gap between compressed surfaces for tighter joints.

Tecbond 110B-PR

Tecbond 110B-PR is a light-brown biodegradable bulk hot melt adhesive with a very fast setting speed designed for high-speed packaging applications. Available in prill format, the adhesive facilitates increased production and faster assembly of cartons.

Tecbond 110-PR works with most bulk hot melt tanks, and can be applied via spray or jet. Its low viscosity decreases nozzle stringing while promoting clean running.

Tecbond 214B

Tecbond 214B is a biodegradable packaging adhesive, formulated with 45% bio-based, sustainably sourced raw materials. Tecbond 214B is based on the best-selling Tecbond 214 packaging adhesive.

The degradation process will occur in the presence of oxygen. When the adhesive is exposed to ultraviolet light, the speed of the degradation process is greatly increased. The adhesive should be kept away from direct sunlight when not in use.

Tecbond 214B’s short open time speeds up carton closing procedures, with no need for extended holding or clamping periods after compression. Coupled with the adhesives cost per closure, Tecbond 214B is the ideal replacement for staples or tape for cardboard bonding applications.

Tecbond 7714

Tecbond 7714 is an amber polyamide adhesive designed for product assembly applications where a high heat resistance is required. Tecbond 7714 is resistant to temperatures as high as 95°C and as low as -10°C with stable bonds on materials such as wood, metal, cardboard, and many plastics.

Similarly to Tecbond 7713, Tecbond 7714 can also be used as a knot filling compound thanks to its flexibility and bond strength once it has cooled.