Tecbond 7718-PR

Tecbond 7718-PR is a bulk format, polyamide hot melt adhesive designed for potting and encapsulation applications. Available in amber and black, Tecbond 7718-PR has very low viscosity to improve flow rate and ensure clean running during extended production runs. Coupled with it’s fast setting time of around two minutes, Tecbond 7718-PR is ideal for speeding up production processes.

Tecbond 7718 has been used for many years in the consumer electronics industry to protect electronic components and ensure there is no movement which could cause lasting damage.