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Tecbond 7786-FR

High Temperature Resistant Adhesive

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Tecbond 7786-FR is a polyamide hot melt adhesive specifically designed with class-leading high and low-temperature resistance. Predominantly used for low-volume overmoulding and product assembly applications in the electronics industry, Tecbond 7786-FR provides excellent bonds on light gauge metals, PCBs, and many plastics such as PVC and ABS.

Coupled with its high and low-temperature resistance, Tecbond 7786-FR has a very high molten tack that provides an almost instant grab upon substrate compression.

We recommend that Tecbond 7786-FR be kept in its original packaging out of direct sunlight to ensure maximum shelf life.

Sizes (mm):

Bulk

Categories :

Industrial & Manufacturing, Product Assembly

Chemistry:

Polyamide

Open time:

<10 seconds

Application temp:

180-215°C

Viscosity / cPs – Adhesive:

4800 @ 190 °C

Softening point:

155°C

Heat resistance:

145°C

Low temp:

-40°C

Colour:

Black

Tecbond 7786-FR

Related applications

Cable Attachment

Revolutionise cable management with hot melt adhesives – a game-changing solution for attaching electrical cables to a range of different surfaces.

Potting & Encapsulating

Bringing flexibility along with strength and security to encapsulation, our hot melt grades are the premium product for protecting sensitive electrical equipment.

Low-Volume Over Moulding

Whether it’s extra-protection for fragile componentry, or to add rubberised characteristics to your substrates, our over moulding solutions provide an alternative and more cost-effective solution.

Sports Equipment

Engineered to withstand the rigorous conditions of professional and recreational sports, our range of adhesives are designed to meet the unique challenges of this dynamic field.

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