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Tecbond 7786-PR

Hochtemperaturbeständiger Klebstoff

Tecbond 7786-PR is a polyamide hot melt adhesive specifically designed with class-leading high and low-temperature resistance. Predominantly used for low-volume overmoulding and product assembly applications in the electronics industry, Tecbond 7786-PR provides excellent bonds on light gauge metals, PCBs, and many plastics such as PVC and ABS.

Coupled with its high and low-temperature resistance, Tecbond 7786-PR has a very high molten tack that provides an almost instant grab upon substrate compression.

We recommend that Tecbond 7786-PR be kept in its original packaging out of direct sunlight to ensure maximum shelf life.

Größen (mm):
Bulk
Chemie:
Polyamid
Offene zeit:
<10 seconds
Auftragstemperatur:
180-215
Viskosität / cPs - Klebstoff:
Erweichungspunkt:
Hitzebeständigkeit:
Niedrige Temperatur:
Farbe:
Schwarz
Tecbond 7786-PR

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