Tecbond 6002 is a pale amber, low-odour packaging adhesive designed for high-speed packaging runs where fast setting speeds are required. Predominantly used for carton closing and wrap around packaging, Tecbond 6002 will bond most paper and cardboard substrates.
Its very high molten tack, along with its short open time means bonds are near instantaneous upon compression, within little to no holding time required.
Tecbond 214B is a biodegradable packaging adhesive, formulated with 45% bio-based, sustainably sourced raw materials. Tecbond 214B is one of the best-selling packaging adhesives due to its strong bonding capabilities, high molten tack, and fast setting speeds.
The degradation process will occur in the presence of oxygen. When the adhesive is exposed to Ultraviolet light the speed of the degradation process is greatly increased. The adhesive should be kept away from direct sunlight when not in use.
Tecbond 214B’s short open time speeds up carton closing procedures, with no need for extended holding or clamping periods after compression. Coupled with the adhesives cost per closure, Tecbond 214B is the ideal replacement for staples or tape for cardboard bonding applications.
Tecbond 7714 is an amber polyamide adhesive designed for product assembly applications where a high heat resistance is required. 7714 is resistant to temperatures as high as 95°C and as low as -10°C with stable bonds on materials such as wood, metal, cardboard, and many plastics.
Similarly to Tecbond 7713, Tecbond 7714 can also be used as a knot filling compound thanks to its flexibility and bond strength once it has cooled.
Tecbond 1X is a woodworking and packaging adhesive designed to bond cardboard, paper, and wood substrates. Tecbond 1X has been specifically formulated to have a lower viscosity than many other market comparable adhesives, resulting in better surface penetration and tighter final joints.
Alongside tighter joints, Tecbond 1X’s low viscosity provides excellent output when used with Tec applicators.
Tecbond 1942 is a packaging and woodworking adhesive designed to bond several types of plastic and difficult to bond substrates to wooden surfaces. Some of these substrates include nylon, ABS, rigid PVC, melamine and light-gauge metals.
Tecbond 1942 has been formulated to have a short open time, leading to increased installation speed and providing a strong bond within minutes of compression.
Tecbond 244 is a light brown, economical packaging adhesive designed for use on most paper and board substrates.
One of the most cost-effective adhesives in the tecbond range, thanks to its cost per closure, tecbond 244 is a favourite of product manufacturers for their carton closing needs.
Featuring a high tack and short open time, Tecbond 244 provides an almost instant hold upon compression, removing the need for extended holding periods, and speeding up the overall production process. It provides an instant grab and sets to a strong bond when parts are compressed.
Foundrytec 708 is an amber coloured, polyamide-based hot melt adhesive designed for bonding sand cores in the foundry industry. Foundrytec 708 has class-leading heat-resistance and allows finished cores to be oven dried at much higher temperatures.
When compared to Foundrytec 705, Foundrytec 708 has a lower viscosity for tighter joins between core pieces and a shorter open time leading to faster formation of the overall bond.
Foundrytec 705 is an amber coloured, polyamide-based hot melt adhesive designed for bonding sand cores in the foundry industry. Foundrytec 705 has class-leading heat-resistance and allows finished cores to be oven dried at much higher temperatures of up to 130°C.
The adhesives low char prevents discolouration and blockages in the applicator, while its high tack provides near instant hold and fast bonds on both large and small sand cores.
Foundrytec 601 is a pale-amber hot melt adhesive designed for bonding sand cores in the foundry industry. Foundrytec 601 is designed to have a very fast setting speed, removing the need for storage spaces dedicated to core drying.
Alongside its rapid setting speeds, Foundrytec 601 has good heat resistance, ideal for cores that require oven drying after completion.
Foundrytec 501 is a pale-amber hot melt adhesive designed for bonding sand cores in the foundry industry. Foundrytec 501 has a lower viscosity that other Foundrytec grades to facilitate very close bonds between cores. This reduces the risk of deformations in the finished product.
The adhesives low viscosity also prevents stringing from the applicator nozzle and improves overall adhesive output.
Foundrytec 301 is a pale-amber hot melt adhesive designed for bonding sand and ceramic cores in the foundry industry. Foundrytec 301 prioritises bond strength between sand cores, with a slightly slower setting speed than other Foundrytec grades.
Foundrytec 301 has extremely low ash content (below 0.02%) reducing the risk of outgassing in the moulds. This formulation is ideal for steel foundries where ceramic runner systems are used.
