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Mercati e applicazioni

Tecbond 901-PL

Clear Pressure Sensitive Adhesive

Tecbond 901-PL is a low viscosity pressure sensitive hot melt adhesive designed for applications that require good heat resistance and high sheer strength.

Although most effective around 195°C, Tecbond 901-PL can be applied at lower temperatures to avoid damaging heat sensitive materials such as foam, Styrofoam and other forms of expanded polystyrene.

Clear in colour, the adhesive is near invisible after application as to not disrupt the visual appeal of the product.

Dimensioni (mm):
Bulk
Categorie :
Chimica:
Gomma
Offene zeit:
Permanent
Auftragstemperatur:
180°C
Viskosität / cPs - Adesivo:
2800
Punto di rammollimento:
96°C
Resistenza al calore:
65°C
Bassa temperatura:
-20°C
Colore:
Libero
Tecbond 901-PL
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