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Tecbond 213

General Purpose Hot Melt Adhesive

Tecbond 213 is a general-purpose hot melt adhesive designed to bond substrates commonly used in product assembly applications and the flooring industry.

Excellent bonds can be achieved on ceramics, rigid PVC, wood, fabric, and many plastics. Outside of product assembly, Tecbond 213 is also used in the flooring and woodworking industries thanks to its strong bonding capabilities.

Featuring a high tack and ample open time, Tecbond 213 is one of the most efficient and cost-effective general-purpose hot melt adhesives on the market today.

Sizes (mm):
12, 15, 43
Chemistry:
EVA
Open time:
30 seconds
Application temp:
195
Viscosity / cPs – Adhesive:
Softening point:
Heat resistance:
Low temp:
Colour:
Pale Amber
Tecbond 213

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