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Markets & Applications

Glue Size: Bulk

Tecbond 355B-PR

Tecbond 355B-PR is a biodegradable, bulk format, metallocene-based packaging adhesive formulated to bond difficult substrates, especially those which have a lacquered or varnished finish. It is one of the most high-performance adhesives in the Tecbond bulk range.

Its fast-setting speed, coupled with low temperature resistance makes it the ideal adhesive for manufacturers of packaging that may experience storage temperatures as low as -30°C. The adhesive has very low thermal degradation/charring, which contributes to its clean running capabilities.

The degradation process will occur in the presence of oxygen. When the adhesive is exposed to ultraviolet light, the speed of the degradation process is greatly increased. The adhesive should be kept away from direct sunlight when not in use.

Tecbond 902B-PL

Tecbond 902B-PL is a biodegradable, pressure sensitive hot melt adhesive with very high levels of tack for difficult applications requiring a “permanent” open time. The adhesives low viscosity makes it the ideal pressure sensitive formulation for spraying. Alongside its biodegradability, the formulation is made from 51% bio-based materials.

Tecbond 902B-PL is a component in products such as crash helmets, protective clothing and flight-cases, as well as packaging applications such as jiffy bag sealers. The adhesive has good heat resistance for a bulk adhesive, allowing for use in warmer conditions without the risk of adhesive creep.

The degradation process will occur in the presence of oxygen. When the adhesive is exposed to ultraviolet light, the speed of the degradation process is greatly increased. The adhesive should be kept away from direct sunlight when not in use.

Tecbond LM41-PR

Tecbond LM41-PR is a clear, all-purpose bulk adhesive formulated for use in low melt bulk systems. Featuring impressive output with clean running capabilities, its class-leading bond strength provides excellent adhesion to a range of substrates, including paper, card, wood, ceramic, fabric, foam, and some plastics including coated boards.

Used across a number of industries including packaging, product assembly, construction and DIY, the adhesive has very low viscosity, even at 130°C (266°F) allowing it to better penetrate porous substrates.

Tecbond 7786-FR

Tecbond 7786-FR is a polyamide hot melt adhesive specifically designed with class-leading high and low-temperature resistance. Predominantly used for low-volume overmoulding and product assembly applications in the electronics industry, Tecbond 7786-FR provides excellent bonds on light gauge metals, PCBs, and many plastics such as PVC and ABS.

Coupled with its high and low-temperature resistance, Tecbond 7786-FR has a very high molten tack that provides an almost instant grab upon substrate compression.

We recommend that Tecbond 7786-FR be kept in its original packaging out of direct sunlight to ensure maximum shelf life.

Tecbond 7784-PR

Tecbond 7784-PR is a bulk polyamide adhesive designed for use on metal, wood, glass, ceramics, and many plastics. Tecbond 7784-PR has been specially formulated to provide both high and low-temperature resistance, with strong and flexible bonds at temperatures as high as 120°C and as low as -60°C. This makes it especially useful for many product-assembly and electrical applications involving working machinery.

As with many other polyamide adhesives, Tecbond 7784-PR is resistant to most oils, fuels, and grease as well as mild chemicals. It is commonly used in car engines and oil filters to not only hold components in place but also prevent some components from coming into contact with each other (such as oil filter fins).

Tecbond 7718-PR

Tecbond 7718-PR is a bulk format, polyamide hot melt adhesive designed for potting and encapsulation applications. Available in amber and black, Tecbond 7718-PR has very low viscosity to improve flow rate and ensure clean running during extended production runs. Coupled with it’s fast setting time of around two minutes, Tecbond 7718-PR is ideal for speeding up production processes.

Tecbond 7718 has been used for many years in the consumer electronics industry to protect electronic components and ensure there is no movement which could cause lasting damage.

Tecbond 260-PR

Tecbond 260-PR is a pale amber bulk adhesive formulated to provide superior adhesion to ceramics, wood, metal, glass, and many plastics. Bonds formed using Tecbond 260-PR are not only tough, but also flexible, able to withstand small movements between substrates, even when fully set. This makes it the ideal adhesive for many product assembly applications.

The adhesives ample open time facilitates not only slower moving production lines, but larger-scale bonding applications.

Tecbond 213-PR

Tecbond 213-PR is a general-purpose bulk hot melt adhesive designed to bond substrates commonly used in product assembly applications.

Excellent bonds can be achieved on ceramics, rigid PVC, wood, fabric, and many plastics (excluding PP and PE). Outside of product assembly, Tecbond 213 is also used in the woodworking industry thanks to its strong bonding capabilities.

Featuring a high tack and ample open time, Tecbond 213-PR is one of the most cost-effective all-around bulk hot melts in the Tecbond range.

Tecbond 23-PR

Tecbond 23 is a multi-purpose product assembly adhesive in a prill format. The adhesive will provide strong and reliable bonds on a number of common construction materials such as ceramics, wood, fabrics, and many plastics such as PVC, polycarbonate, and acrylics (not PP or PE).

The adhesives extended open and working time provide security in the production process, allowing adjustments to be made shortly after initial compression before the final bond is made.

Tecbond 14-PR

Tecbond 14-PR is a fast-setting bulk adhesive designed for packaging applications predominately those involving paper and board substrates. It is ideal for carton closing and tray forming, and suitable for specialty packaging, point of sale, and wrap-around cartons.

The adhesive is formulated to maximise delivery rate, and sets very fast when compressed. These two features mean packages can be secured in a fraction of the time when compared to taping or stapling. There’s also no need to hold the materials in place as the bond is almost instantaneous.

Tecbond 268-PL

Tecbond 268-PL is a bulk format, product assembly adhesive, designed to bond difficult plastics including polypropylene and polyethylene.

Tecbond 268-PL has been formulated to have class-leading high temperature resistance, allowing it to both be applied at warmer temperatures without affecting setting speeds, and have the final bond be exposed to temperatures exceeding 90°C without failing.

Alongside its high-temperature resistance, Tecbond 268-PL has a shorter open time for fast-paced manufacturing facilities.

Due to the difficulties involved in bonding PP and PE, it’s recommended that the adhesive is applied at 195°C (383°F) or higher.

Tecbond 901-PL

Tecbond 901-PL is a low viscosity pressure sensitive hot melt adhesive designed for applications that require good heat resistance and high sheer strength.

Although most effective around 195°C, Tecbond 901-PL can be applied at lower temperatures to avoid damaging heat sensitive materials such as foam, Styrofoam and other forms of expanded polystyrene.

Predominantly used in the packaging industry, the adhesive is clear in colour, making it near invisible after application as to not disrupt the visual appeal of the product.