Tecbond 803-PL is an economical bulk hot melt adhesive designed to provide a light, peelable bond between substrates.
Ideal for scenarios where the bond is not visible, Tecbond 803-PL is primarily used to provide a light bond when attaching promotional material to magazines or letters. The adhesives clean running characteristics result in reduce stringing and low char when left in bulk tanks.
Tecbond 802-PL is a bulk hot melt adhesive designed to provide a light, peelable bond to many plastics.
Similarly to Tecbond 210, Tecbond 802-PL is primarily used to bond credit cards, labels and promotional items to printed material. The adhesive is designed to be very clean running with low char and stringing characteristics.
Although the bond is strong enough to hold the required materials, it will easily peel away with enough force, without damaging the substrates.
Tecbond 355-PR is a bulk format, metallocene-based packaging adhesive formulated to bond difficult substrates, especially those which have a lacquered or varnished finish. It is one of the most high-performance adhesives in the Tecbond bulk range.
Its fast-setting speed, coupled with low temperature resistance makes it the ideal adhesive for manufacturers of packaging that may experience storage temperatures as low as -30°C. The adhesive has very low thermal degradation/charring, which contributes to its clean running capabilities.
Tecbond 273-PL is a bulk format, product assembly adhesive, designed to provide greater versatility when bonding a wide range of substrates including polypropylene.
With a slightly lower viscosity than Tecbond 271 and 272, Tecbond 273 is clean running, with good low temperature resistance for an economical grade.
The final bond is less brittle and solid than other comparable adhesives, allowing for some flexibility without bond failure.
Tecbond 272-PL is a bulk format, product assembly adhesive, designed to bond difficult plastics including polypropylene and polyethylene.
Tecbond 272-PL has been formulated to have class-leading high temperature resistance, allowing it to both be applied at warmer temperatures without affecting setting speeds, and have the final bond be exposed to temperatures exceeding 90°C without failing.
Alongside its high-temperature resistance, Tecbond 272-PL has a shorter open time for fast-paced manufacturing facilities.
Due to the difficulties involved in bonding PP and PE, it’s recommended that the adhesive is applied at 195°C (383°F) or higher.
Tecbond 271-PL is a bulk format, product assembly adhesive, specifically formulated to bond polypropylene and polyethylene. It will also effectively bond most other plastics, non-woven materials and fabrics.
The adhesive exhibits very good low temperature resistance, making it the ideal bonding solution for products that may be exposed to sub-zero temperatures. Tecbond 271-PL has a longer open time than most other polypropylene bonding formulations, aiding in longer production runs where substrates may not be immediately brought together.
Due to the difficulties involved in bonding polypropylene and polyethylene, it’s recommended that the adhesive is applied at 195°C (383°F) or higher.
Tecbond 214-PR is an economical packaging adhesive designed for use on most paper and board substrates. Tecbond 214-PR is the bulk version of Tecbond 214 and as such, is one of the best-selling bulk adhesives in the Tecbond bulk range.
Formulated using 40% bio-based materials, Tecbond 214-PR’s short open time speeds up carton closing procedures, with no need for extended holding or clamping periods after compression. Coupled with the adhesives cost per closure, Tecbond 214-PR is the ideal replacement for staples or tape for cardboard bonding applications.
Tecbond 440-PL is a high-performance bulk hot melt adhesive that provides near instant bonds on a number of substrates including cardboard, wood, foam and many plastics.
Designed to work with both spray and bead applicators, the adhesive has an open time up to four minutes in spray form and slightly longer in bead format.
Predominantly used in product assembly applications, Tecbond 440-PL is clean running and works with most automated application machinery.
Tecbond 430-PL is a bulk sprayable hot melt adhesive, formulated to have a longer open time for larger bonding applications. The adhesive is compatible with bulk spray machinery including XY plotters.
Designed for use on wood, plastics, and many board substrates, Tecbond 430-PL has an open time of up to six minutes, ideal for industries who don’t always compress substrates immediately after adhesive application.
Tecbond 430-PL exhibits good heat resistance for a sprayable adhesive, with bonds able to experience temperatures of up to 90°C without failing.
The adhesive cools rapidly upon extrusion ensuring it doesn’t melt or burn sensitive substrates, while the increased coverage ensures there is a much stronger bond than possible with traditional bead application.
Tecbond 425 is a bulk sprayable hot melt adhesive, with very high tack designed for general-purpose applications. The adhesive is compatible with bulk spray machinery including XY plotters.
Suitable for use on wood, many plastics and heat-sensitive materials such as foams and expanded polystyrene, Tecbond 425-PL is an all-around general-purpose adhesive for product assembly applications.
Its high output, coupled with its lower viscosity than Tecbond 410 and 420, speeds up production processes, ideal for high volume businesses.
The adhesive cools rapidly upon extrusion ensuring it doesn’t melt or burn sensitive substrates, while the increased coverage ensures there is a much stronger bond than possible with traditional bead guns.
Tecbond 420-PL is a bulk sprayable hot melt adhesive, formulated for use on heat-sensitive substrates. The adhesive is compatible with bulk spray machinery including XY plotters.
Primarily used in the manufacture of mattresses and HVAC units, Tecbond 420-PL can also be used to bond foam and fabrics in the creation of furniture.
Its three-minute open time allows for the accurate positioning of substrates prior to compression, without the worry of the adhesive losing its tack.
The adhesive cools rapidly upon extrusion ensuring it doesn’t melt or burn sensitive substrates, while the increased coverage ensures there is a much stronger bond than possible with traditional bead application.
Tecbond 410-PR is a bulk sprayable hot melt adhesive, formulated with low tack to aid in easy removal. The adhesive is compatible with bulk spray machinery including XY plotters.
Predominately used for pallet stabilisation and tile spacing, the adhesive’s application method also makes it ideal for attaching lightweight foams and polystyrene to the insides of protective cases.
Its low tack is designed to provide a sufficient bond, but can be easily removed without causing substrate damage.
The adhesive cools rapidly upon extrusion ensuring it doesn’t melt or burn sensitive substrates, while the increased coverage ensures there is a much stronger bond than possible with traditional bead application.
